Rujun Ma

Prof. Rujun Ma received his Ph. Dfrom the Institute of Nanotechnology of Sungkyunkwan University in Korea inFebruary 2013, and then worked as a postdoctoral researcher at the School ofEnergy Sciences and Basic Science of the same University. In April 2015, hejoined UCLA working as a postdoctoral researcher in the team of ProfessorQibing Pei. In September 2018, he joined the School of Materials Science andEngineering at Nankai University working as a professor.

In recent years, he has publishedmore than ten papers in internationally renowned journals such as Science,Chemical Society Reviews, Advanced Materials, Nano Letters and ACS nano as acorrespondence or first author; authorized 5 US and South Korean patents,applied for 2 international patents, and 5 Chinese patents.

The person in charge of the keyspecial project of the National Key R&D Program of the Ministry of Scienceand Technology of the "Transformative Technology"; presided over 1international exchange project and 1 general project of the National NaturalScience Foundation of China.

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Thin film thermal management system for temperature control of electronic devices

Nowdays, as the integration ofelectronic chips continues to increase, the total power consumption ofintegrated circuits has risen exponentially, and the problem of chip failurewill become more and more prominent. Among all the failure phenomena ofelectronic devices, the thermal failure rate accounts for about 55%. It can beseen that chip heat dissipation technology has been an important restrictivefactor affecting the development of the electronics industry. On the basis ofexisting heat dissipation technology, the development of cooling technology forchips is an important guarantee for the effective operation of electronicdevices. Here, we reported a cooling device with a high intrinsic thermodynamicefficiency using a flexible electrocaloric (EC) polymer film and anelectrostatic actuation mechanism. [1] The use of reversible electrostaticforces reduces parasitic power consumption and allows efficient heat transferthrough instantaneous formation of good thermal contacts with the heat sourceor sink. The thin-film EC cooling device is flexible and can conform tocurvilinear surfaces. To further improve the EC performance of cooling device,a double-unit EC polymer-based refrigeration device with high intrinsicthermodynamic efficiency was demonstrated using a flexible EC polymer film withimproved performance by doping plasticizer and an electrostatic actuationmechanism. [2] The highly efficient and compact EC cooling device demonstratedhere not only leapfrogs the performance of existing solid-state coolingtechnologies, but also brings solid state cooling closer to reality for avariety of practical applications that require compact or mechanically flexiblerefrigeration.

[1]   R. Ma, Z. Zhang, K. Tong, D. Huber, R. Kornbluh, Y.S. Ju andQ. Pei, Science, 2017, 357, 1130.

[2]   Y. Bo, Q. Zhang, H. Cui, M. Wang, C.Zhang, W. He, X. Fan, Y. Lv, X. Fu, J. Liang, Y. Huang, R. Ma and Y. Chen, Adv. Energy Mater.,2021, 2003771.